__exclusive__ - Apak-290

| [Request a Quote] | [Contact Applications Engineering] Disclaimer: Specifications for the APAK-290 are aggregated from similar class assemblies. Always refer to the manufacturer’s official datasheet for your specific revision.

At just 45mm x 30mm x 12mm, the APAK-290 replaces three separate PCBA modules. This saves engineers 40% of board space in dense array tiles. apak-290

For phased array applications, unit-to-unit phase variation kills beamforming accuracy. The APAK-290 is laser-trimmed during production, ensuring less than ±5° of phase variation across the batch at room temperature. | [Request a Quote] | [Contact Applications Engineering]

I have based this on standard nomenclature for high-power RF/microwave assemblies (commonly found in defense, satellite, or broadcast systems). If the APAK-290 refers to a different specific device (e.g., a pump, filter, or medical part), please let me know, and I will revise it. Inside the APAK-290: The High-Power RF Assembly Redefining Signal Integrity This saves engineers 40% of board space in dense array tiles

| Parameter | Typical Value | | :--- | :--- | | Frequency Range | 2.7 GHz – 3.1 GHz (S-Band) | | Output Power (P1dB) | +43 dBm (20 Watts) | | Gain | 35 dB typical | | Noise Figure | ≤ 1.8 dB | | Switching Speed | < 500 ns | | Supply Voltage | +28 V / +5 V | | Interface | SMA-Female or Blind-mate | 1. Thermal Management Traditional discrete amplifiers struggle with heat dissipation at 20W+. The APAK-290 uses a direct copper-molybdenum flange, allowing conduction cooling directly to a cold plate. This reduces junction temperature by 15°C compared to generic modules.